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sn75150 dual line driver slls081c january 1971 revised june 1999 1 post office box 655303 ? dallas, texas 75265 meets or exceeds the requirement of tia/eia-232-f and itu recommendation v.28 withstands sustained output short circuit to any low-impedance voltage between 25 v and 25 v 2- m s maximum transition time through the 3-v to 3-v transition region under full 2500-pf load inputs compatible with most ttl families common strobe input inverting output slew rate can be controlled with an external capacitor at the output standard supply voltages . . . 12 v description the sn75150 is a monolithic dual line driver designed to satisfy the requirements of the standard interface between data-terminal equipment and data-communication equipment as defined by tia/eia-232-f. a rate of 20 kbits/s can be transmitted with a full 2500-pf load. other applications are in data-transmission systems using relatively short single lines, in level translators, and for driving mos devices. the logic input is compatible with most ttl families. operation is from 12-v and 12-v power supplies. the sn75150 is characterized for operation from 0 c to 70 c. logic symbol 2 7 6 2 this symbol is in accordance with ansi/ieee std 91-1984 and iec publication 617-12. en 1y 2y s 1a 2a 3 2 1 logic diagram (positive logic) 3 2 1 ?? ?? ?? ?? ?? s 1a 2a 7 6 1y 2y copyright ? 1999, texas instruments incorporated production data information is current as of publication date. products conform to specifications per the terms of texas instruments standard warranty. production processing does not necessarily include testing of all parameters. please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 1 2 3 4 8 7 6 5 s 1a 2a gnd v cc+ 1y 2y v cc d or p package (top view)
sn75150 dual line driver slls081c january 1971 revised june 1999 2 post office box 655303 ? dallas, texas 75265 schematic (each line driver) v cc line driver to other gnd strobe s to other line driver 4.5 k w 15 k w 7 k w v cc + input a 15 k w 10 k w 15 k w 5 k w 47 w output y 10 k w 5 k w 1 k w 47 w 11 k w to other line driver line driver to other resistor values shown are nominal.
sn75150 dual line driver slls081c january 1971 revised june 1999 3 post office box 655303 ? dallas, texas 75265 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) 2 supply voltage, v cc + (see note 1) 15 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . supply voltage, v cc 15 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . input voltage, v i 15 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . applied output voltage 25 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . package thermal impedance, q ja (see notes 2 and 3): d package 197 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . p package 104 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . storage temperature range, t stg 65 c to 150 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 stresses beyond those listed under aabsolute maximum ratingso may cause permanent damage to the device. these are stress rating s only, and functional operation of the device at these or any other conditions beyond those indicated under arecommended operating conditi onso is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. notes: 1. voltage values are with respect to network ground terminal. 2. maximum power dissipation is a function of t j (max), q ja , and t a . the maximum allowable power dissipation at any allowable ambient temperature is p d = (t j (max) t a )/ q ja . operating at the absolute maximum t j of 150 c can impact reliability. 3. the package thermal impedance is calculated in accordance with jesd 51, except for through-hole packages, which use a trace length of zero. recommended operating conditions min nom max unit su pp ly voltage v cc+ 10.8 12 13.2 v s u ppl y v oltage v cc 10.8 12 13.2 v high-level input voltage, v ih 2 5.5 v low-level input voltage, v il 0 0.8 v driver output voltage, v o 15 v operating free-air temperature, t a 0 70 c
sn75150 dual line driver slls081c january 1971 revised june 1999 4 post office box 655303 ? dallas, texas 75265 electrical characteristics over recommended operating free-air temperature range, v cc = 13.2 v (unless otherwise noted) parameter test conditions min typ 2 max unit v oh high-level output voltage v cc + = 10.8 v, v il = 0.8 v, v cc = 10.8 v, r l = 3 k w to 7 k w 5 8 v v ol low-level output voltage (see note 4) v cc + = 10.8 v, v ih = 2 v, v cc = 10.8 v, r l = 3 k w to 7 k w 8 5 v i ih high level in p ut current data input v i =24v 1 10 m a i ih high - le v el inp u t c u rrent strobe input v i = 2 . 4 v 2 20 m a i il low level in p ut current data input v i =04v 1 1.6 ma i il lo w- le v el inp u t c u rrent strobe input v i = 0 . 4 v 2 3.2 ma 3 v o = 25 v 2 8 i os short circuit out p ut current 3 v o = 25 v 3 8 ma i os short - circ u it o u tp u t c u rrent 3 v o = 0, v i = 3 v 10 15 30 ma v o = 0, v i = 0 10 15 30 i cch + supply current from v cc + , high-level output v i = 0, r l = 3 k w , 10 22 ma i cch supply current from v cc , high-level output i , l , t a = 25 c 1 10 ma i ccl + supply current from v cc + , low-level output v i = 3 v, r l = 3 k w , 8 17 ma i ccl supply current from v cc , low-level output il t a = 25 c 9 20 ma 2 all typical values are at v cc + = 12 v, v cc = 12 v, t a = 25 c. 3 not more than one output should be shorted at a time. note 4: the algebraic convention, in which the less positive (more negative) limit is designated as minimum, is used in this dat a sheet for logic levels only, e.g., when 5 v is the maximum, the typical value is a more negative voltage. switching characteristics, v cc + = 12 v, v cc = 12 v, t a = 25 c (see figure 1) parameter test conditions min typ max unit t tlh transition time, low-to-high-level output c l = 2500 p fr l =3k w to 7k w 0.2 1.4 2 m s t thl transition time, high-to-low-level output c l = 2500 pf , r l = 3 k w to 7 k w 0.2 1.5 2 m s t tlh transition time, low-to-high-level output c l =15 p fr l =7k w 40 ns t thl transition time, high-to-low-level output c l = 15 pf , r l = 7 k w 20 ns t plh propagation delay time, low-to-high-level output c l =15 p fr l =7k w 60 ns t phl propagation delay time, high-to-low-level output c l = 15 pf , r l = 7 k w 45 ns
sn75150 dual line driver slls081c january 1971 revised june 1999 5 post office box 655303 ? dallas, texas 75265 parameter measurement information t tlh t thl pulse generator (see note a) output c l (see note b) v cc + 3 v v cc r l test circuit 90% 50% 10% 10 ns 50 m s t phl t plh 3 v 3 v 3 v 3 v 3 v 0 v v oh v ol output 10 ns 50% 90% 10% input notes: a. the pulse generator has the following characteristics: duty cycle 50%, z o 50 w . b. c l includes probe and jig capacitance. figure 1. test circuit and voltage waveforms
sn75150 dual line driver slls081c january 1971 revised june 1999 6 post office box 655303 ? dallas, texas 75265 typical characteristics 25 io output current ma v o applied output voltage v 20 25 20 20 15 10 5 0 5 10 15 20 15 10 5 0 5 10 15 v cc + = 12 v v cc = 12 v t a = 25 c v i = 2.4 v r l = 3 k w r l = 7 k w v i = 0.4 v output current vs applied output voltage i o figure 2
package option addendum www.ti.com 10-jun-2014 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples SN75150D active soic d 8 75 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 75150 SN75150Dg4 active soic d 8 75 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 75150 SN75150Dr active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 75150 SN75150Dre4 active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 75150 sn75150jg obsolete cdip jg 8 tbd call ti call ti 0 to 70 sn75150p active pdip p 8 50 pb-free (rohs) cu nipdau n / a for pkg type 0 to 70 sn75150p (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device.
package option addendum www.ti.com 10-jun-2014 addendum-page 2 (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN75150Dr soic d 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 q1 package materials information www.ti.com 19-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN75150Dr soic d 8 2500 340.5 338.1 20.6 package materials information www.ti.com 19-mar-2008 pack materials-page 2
mechanical data mcer001a january 1995 revised january 1997 post office box 655303 ? dallas, texas 75265 jg (r-gdip-t8) ceramic dual-in-line 0.310 (7,87) 0.290 (7,37) 0.014 (0,36) 0.008 (0,20) seating plane 4040107/c 08/96 5 4 0.065 (1,65) 0.045 (1,14) 8 1 0.020 (0,51) min 0.400 (10,16) 0.355 (9,00) 0.015 (0,38) 0.023 (0,58) 0.063 (1,60) 0.015 (0,38) 0.200 (5,08) max 0.130 (3,30) min 0.245 (6,22) 0.280 (7,11) 0.100 (2,54) 0 15 notes: a. all linear dimensions are in inches (millimeters). b. this drawing is subject to change without notice. c. this package can be hermetically sealed with a ceramic lid using glass frit. d. index point is provided on cap for terminal identification. e. falls within mil std 1835 gdip1-t8

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